Antonio Manna, Kenneth June Rebibis, Carine Gerets, Eric Beyne,
A key element for improving 3D stacking reliability is the choice of the right Underfill materials. The Underfill is a specialized adhesive that has the main purposes of locking top and bottom dies; it must fill the gap between bumps and between dies, while reducing the differential movement that would occur during thermal cycling. Traditional underfill processes are based on local dispensing after solder bump reflow (Capillary dispensing), or before flip chip operation with no need of reflow (No ...
Tópico(s): Additive Manufacturing and 3D Printing Technologies
2011 - International Microelectronics Assembly and Packaging Society | IMAPSource Proceedings
Antonio Manna, K. J. Rebibis, C. Gerets, Eric Beyne,
A key element for improving 3D IC stacking and packaging reliability is the choice of the right underfill (UF) material. The underfill is a specialized adhesive whose main purpose is locking together the top and bottom dice; it must fill the gap between bumps and between dice, while reducing the differential movement that would occur during thermal cycling. Traditional underfill processes are based on local dispensing after solder bump reflow (i.e., capillary dispensing), or before flip chip operation ...
Tópico(s): Advanced Surface Polishing Techniques
2012 - | Journal of Microelectronics and Electronic Packaging
Franck A. Atienzar, Eric Novik, Helga H.J. Gerets, Amit Parekh, Claude Delatour, Á. de Pablo Cárdenas, J. S. Macdonald, Martin L. Yarmush, Stéphane Dhalluin,
Drug Induced Liver Injury (DILI) is a major cause of attrition during early and late stage drug development. Consequently, there is a need to develop better in vitro primary hepatocyte models from different species for predicting hepatotoxicity in both animals and humans early in drug development. Dog is often chosen as the non-rodent species for toxicology studies. Unfortunately, dog in vitro models allowing long term cultures are not available. The objective of the present manuscript is to describe ...
Tópico(s): Liver physiology and pathology
2013 - Elsevier BV | Toxicology and Applied Pharmacology
Richard Weaver, Catherine J. Betts, Eric A.G. Blomme, Helga H.J. Gerets, Klaus Gjervig Jensen, Philip Hewitt, Satu Juhila, Gilles Labbe, Michael J. Liguori, Natalie Mesens, Monday O. Ogese, Mikael Persson, Jan Snoeys, James Stevens, Tracy Walker, B. Kevin Park,
Introduction: The liver is an important target for drug-induced toxicities. Early detection of hepatotoxic drugs requires use of well-characterized test systems, yet current knowledge, gaps and limitations of tests employed remains an important issue for drug development.Areas Covered: The current state of the science, understanding and application of test systems in use for the detection of drug-induced cytotoxicity, mitochondrial toxicity, cholestasis and inflammation is summarized. The test systems ...
Tópico(s): Computational Drug Discovery Methods
2017 - Taylor & Francis | Expert Opinion on Drug Metabolism & Toxicology
Richard Weaver, Eric A.G. Blomme, Amy E. Chadwick, Ian M. Copple, Helga H.J. Gerets, Christopher E. Goldring, André Guillouzo, Philip Hewitt, Magnus Ingelman‐Sundberg, Klaus Gjervig Jensen, Satu Juhila, Ursula Klingmüller, Gilles Labbe, Michael J. Liguori, Cerys Lovatt, Paul Morgan, Dean J. Naisbitt, Raymond Pieters, Jan Snoeys, Bob van de Water, Dominic P. Williams, B. Kevin Park,
Drug-induced liver injury (DILI) is a patient-specific, temporal, multifactorial pathophysiological process that cannot yet be recapitulated in a single in vitro model. Current preclinical testing regimes for the detection of human DILI thus remain inadequate. A systematic and concerted research effort is required to address the deficiencies in current models and to present a defined approach towards the development of new or adapted model systems for DILI prediction. This Perspective defines the ...
Tópico(s): Computational Drug Discovery Methods
2019 - Nature Portfolio | Nature Reviews Drug Discovery
Antonio Manna, Kenneth June Rebibis, Joeri De Vos, Lieve Bogaerts, Carine Gerets, Eric Beyne,
Although 3D-IC integration is largely acknowledged as most promising technology to push further the scaling concept of Moore's law, a few important uncertainties are delaying high volume production. Among these uncertainties, the reliability of 3D-IC stacked components is the most important. A key element in 3D stacking reliability is the choice of the correct UF to integrate in the assembly processing: die stacking and final packaging. In this paper we report the recent results coming from the ...
Tópico(s): Electronic Packaging and Soldering Technologies
2012 - International Microelectronics Assembly and Packaging Society | IMAPSource Proceedings
Olivier Thébaud, J. Rasmus Nielsen, Arina Motova, Hazel Curtis, François Bastardie, G E Blomqvist, Fabienne Daurès, Leyre Goti, Jorge Holzer, James Innes, Angela Muench, Arantza Murillas, Rasmus Nielsen, Renato Rosa, Eric M. Thunberg, Sebastián Villasante, Jarno Virtanen, Staffan Waldo, Sveinn Agnarsson, David Castilla Espino, Richard Curtin, Geret DePiper, Ralf Doering, Hans Ellefsen, Juan José García del Hoyo, Sophie Gourguet, Peter Greene, Katell G. Hamon, Alan C. Haynie, Julie B. Kellner, Sakari Kuikka, Bertrand Le Gallic, Claire Macher, Raúl Prellezo, José L. Santiago, Klaas Sys, J.A.E. van Oostenbrugge, Berthe M. J. Vastenhoud,
Abstract While the science supporting fisheries management has generally been dominated by the natural sciences, there has been a growing recognition that managing fisheries essentially means managing economic systems. Indeed, over the past seven decades, economic ideas and insights have increasingly come to play a role in fisheries management and policy. As an illustration of this, the International Council for the Exploration of the Sea (ICES) has been actively seeking to expand the scope of its ...
Tópico(s): Marine Bivalve and Aquaculture Studies
2023 - Oxford University Press | ICES Journal of Marine Science
Antonio Manna, Carine Gerets, Maaike Op de Beeck, Thibault Buisson, Eric Dy, Philippe Soussan,
Introduction Packaging of medical implants has been always a challenging topic due to the strong requirements in term of sizes, biocompatibility and safety [1, 2]. This is often required for placing an implant at a specific location of the body, without disturbing the surrounding tissues, and aiming at avoiding discomfort for the patient. The implants should be packaged in order to have a hermetic closed shield around the device, protecting the human body from diffusion of materials from inside the ...
Tópico(s): Additive Manufacturing and 3D Printing Technologies
2010 - International Microelectronics Assembly and Packaging Society | IMAPSource Proceedings
Giovanni Capuz, Melina Lofrano, Carine Gerets, Fabrice Duval, Pieter Bex, Jaber Derakhshandeh, Kris Vanstreels, Alain Phommahaxay, Eric Beyne, Andy Miller,
Abstract For die to wafer bonding of high-density interconnects and fine pitch microbumps developing and characterizing suitable underfill materials are required. In general, underfill serve to fill the spaces in-between microbumps for protection and reliability. Among the different types of underfill, Non-Conductive Film (NCF) has the advantages of fillet and volume control, and a built-in flux to aid wetting. However, challenges arise for thin dies and microbumps with fine pitches on film lamination, ...
Tópico(s): Electronic Packaging and Soldering Technologies
2020 - International Microelectronics Assembly and Packaging Society | IMAPSource Proceedings
Giovanni Capuz, Melina Lofrano, Carine Gerets, Fabrice Duval, Pieter Bex, Jaber Derakhshandeh, Kris Vanstreels, Alain Phommahaxay, Eric Beyne, Andy Miller,
Abstract For die-to-wafer (D2W) stacking of high-density interconnects and fine-pitch microbumps, underfill serves to fill the spaces in-between microbumps for protection and reliability. Among the different types of underfill, nonconductive film (NCF) has the advantages of fillet and volume control. However, one of the challenges is the solder joint wetting. An NCF must have good embedded-flux activation to mitigate Cu UBM pad oxidation due to the repeated TCB cycles that accelerate oxidation on ...
Tópico(s): Advanced Surface Polishing Techniques
2021 - | Journal of Microelectronics and Electronic Packaging