... the ordered escape routing. First, the characteristic of grid pin array and staggered pin array is analyzed and then a basic ...
Tópico(s): 3D IC and TSV technologies
2018 - Association for Computing Machinery | ACM Transactions on Design Automation of Electronic Systems
Yuan-Kai Ho, Hsu-Chieh Lee, Yao‐Wen Chang,
... PCB routing, is significantly different from that for grid arrays. This paper presents a routing algorithm for the escape routing for staggered-pin-array PCBs. We first analyze the properties of ...
Tópico(s): 3D IC and TSV technologies
2013 - Institute of Electrical and Electronics Engineers | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Zhenyi Gao, Sheqin Dong, Zhicong Tang, Wenjian Yu,
... on multi-capacity OER (MC-OER) both in grid pin arrays and staggered pin arrays (SPA), which means multiple wires are ...
Tópico(s): Advanced Data Storage Technologies
2024 - Association for Computing Machinery | ACM Transactions on Design Automation of Electronic Systems
Guoguang Su, Hamn‐Ching Chen, Je-Chin Han,
Computations with multi-block chimera grids were performed to study the three-dimensional turbulent flow and heat transfer in a rotating rectangular channel with staggered arrays of pin-fins. The channel aspect ratio (AR) is 4:1, the pin length to diameter ratio (H∕D) is 2.0, and ...
Tópico(s): Turbomachinery Performance and Optimization
2006 - ASM International | Journal of Heat Transfer
Marwan Effendy, Yufeng Yao, Daru Sugati, Tri Tjahjono,
... results from an existing TE cutback cooling with staggered pin-fin arrays inside the cooling passage against experimental measurements. Three structured meshes were used for grid convergence and to evaluate film-cooling effectiveness and ...
Tópico(s): Combustion and flame dynamics
2019 - American Institute of Physics | AIP conference proceedings
Di Chen, Prashant Kumar, Yukinori Kametani, Yosuke Hasegawa,
... of 6.9. Moreover, the optimization of a staggered pin-fin array demonstrates that the optimal shapes and arrangement of ...
Tópico(s): Heat Transfer and Optimization
2023 - Elsevier BV | International Journal of Heat and Mass Transfer
Marwan Effendy, Yufeng Yao, Denis Marchant,
... results from an existing TE cutback cooling with staggered pin-fin arrays inside the cooling passage against experimental measurement. Three ...
Tópico(s): Fluid Dynamics and Turbulent Flows
2017 - EDP Sciences | MATEC Web of Conferences
... bottom side of the channel was considered with arrays of rectangular miniature-pin fins. The miniature-pin fin geometry was modeled in a staggered configuration with tip clearance from the opposite surface ...
Tópico(s): Turbomachinery Performance and Optimization
2023 - Taylor & Francis | Numerical Heat Transfer Part A Applications
Yoshikazu Shimote, Toshihiro Iwasaki, Masaki Watanabe, Shinji Baba, Michitaka Kimura,
The flip-chip ball-grid array (FCBGA) package has been applied in the fields of high-end server and network systems to achieve high performance in ... with Cu-pillar bumps at a very fine staggered pitch of 30 μm, utilizing non-conductive paste (NCP) resin to adapt the package for use with devices having large numbers of pins, at least some of which carry high-speed ...
Tópico(s): Copper Interconnects and Reliability
2014 - | Transactions of The Japan Institute of Electronics Packaging