Nobuaki Takahashi, N. Senba, Yuzo Shimada, I. Morisaki, K. Tokuno,
... has almost the same size as single memory packages [thin small outline packages (TSOPs): 17.4/spl times/9.22/spl ...
Tópico(s): 3D IC and TSV technologies
1998 - Institute of Electrical and Electronics Engineers | IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Seung Wook Yoon, Jun Ki Hong, Hwa‐Jung Kim, Kwang Yoo Byun,
... evaluate various Pb-free solder systems for leaded package, thin small outline packages (TSOPs) and chip scale packages (CSPs) including leadframe ...
Tópico(s): Aluminum Alloy Microstructure Properties
2005 - Institute of Electrical and Electronics Engineers | IEEE Transactions on Electronics Packaging Manufacturing
Tópico(s): Manufacturing Process and Optimization
2024 - Springer Science+Business Media | The International Journal of Advanced Manufacturing Technology
Meng‐Kuang Huang, Chiapyng Lee,
... array (BGA), chip scale package (CSP), quad flat package (QFP) and thin small outline package (TSOP), were assembled on a test printed circuit ...
Tópico(s): Electromagnetic Compatibility and Noise Suppression
2008 - Emerald Publishing Limited | Soldering and Surface Mount Technology
D.M. Noctor, F.E. Bader, A.P. Viera, P. Boysan, S. Golwaltar, R. Foehringer,
... term surface mount reliability of Alloy 42 leaded thin small outline packages (TSOPs) using thermal cycling as an acceleration method ...
Tópico(s): Integrated Circuits and Semiconductor Failure Analysis
1993 - Institute of Electrical and Electronics Engineers | IEEE Transactions on Components Hybrids and Manufacturing Technology
John H. Lau, S. Golwalkar, S. Erasmus, R.E. Surratt, P. Boysan,
... reliability of 0.5 mm pitch, 28-Pin Thin Small Outline Package (TSOP) solder joints has been studied by experimental ...
Tópico(s): Advanced Welding Techniques Analysis
1992 - ASM International | Journal of Electronic Packaging
John H. Lau, S. Golwalkar, P. Boysan, R.E. Surratt, R. Forhringer, S. Erasmus,
... reliability of 0.5 mm pitch, 32‐pin thin small outline package (TSOP) solder joints has been studied by experimental ...
Tópico(s): Metal Forming Simulation Techniques
1993 - Emerald Publishing Limited | Circuit World
Seong-Min Lee Seong-Min Lee, Kwon-Woo Lee Kwon-Woo Lee,
... to predict the fatigue life of the plastic thin small outline package (TSOP). The life prediction was done based on ...
Tópico(s): Probabilistic and Robust Engineering Design
1996 - Institute of Physics | Japanese Journal of Applied Physics
Tzyy‐Sheng Horng, Sung-Mao Wu, Chi-Tsung Chiu, Chih-Pin Hung,
... S-parameter measurement. When compared to the standard thin shrink small outline packages (TSSOPs), BCC packages show much smaller parasitics in ...
Tópico(s): Electronic Packaging and Soldering Technologies
2001 - Institute of Electrical and Electronics Engineers | IEEE Transactions on Advanced Packaging
... thin elongated packages with large chips, known as thin small outline packages (TSOPs), and high lead count large square packages ...
Tópico(s): Manufacturing Process and Optimization
1993 - SAGE Publishing | Journal of Reinforced Plastics and Composites
... loop height bonding for thin packaging [such as thin small outline package (TSOP) and thin quad flat package (TQFP)] and high input/output ( ...
Tópico(s): 3D IC and TSV technologies
2000 - Institute of Electrical and Electronics Engineers | IEEE Transactions on Electronics Packaging Manufacturing
Michael Osterman, Michael Pecht,
... formats including ball grid arrays, quad flatpack and thin small outline packages to determine the validity of the model and ...
Tópico(s): Engineering and Materials Science Studies
2007 - Emerald Publishing Limited | Soldering and Surface Mount Technology
Sung Yi, Jing Sua Goh, Ji Cheng Yang,
... stresses developed in thin lead-on-chip (LOG) thin small outline packages (TSOP) during the reflow soldering process preceded by ...
Tópico(s): Mechanical Behavior of Composites
1997 - Institute of Electrical and Electronics Engineers | IEEE Transactions on Components Packaging and Manufacturing Technology Part B
... thermomechanical responses of a lead-on-chip (LOC), thin small outline package (TSOP) are investigated. Three linear cool down temperature ...
Tópico(s): 3D IC and TSV technologies
1998 - ASM International | Journal of Electronic Packaging
... packaging studies are reviewed. They include analyses of thin small outline package, leadless chip carrier package, surface mount array package, ...
Tópico(s): 3D IC and TSV technologies
1995 - ASM International | Journal of Electronic Packaging
Kiyoshi Miyake, Tsukasa Yoshida, Hyung Gil Baik, Sang Wook Park,
... to investigate the best method for predicting the thin small outline packages (TSOP) warpage. The results indicate that viscoelastic-GK calculation with relaxation of shear modulus and of bulk modulus using the multilayer shell ...
Tópico(s): Adhesion, Friction, and Surface Interactions
2001 - ASM International | Journal of Electronic Packaging
Tzyy‐Sheng Horng, Sung-Mao Wu, Chih‐Cheng Shih,
... A real example on modeling a 16-lead Thin Shrink Small Outline Package (TSSOP) has been demonstrated. The established model can ...
Tópico(s): 3D IC and TSV technologies
2001 - Institute of Electrical and Electronics Engineers | IEEE Transactions on Advanced Packaging
J.-P.M. Clech, J.C. Manock, D.M. Noctor, F.E. Bader, J. A. Augis,
... technology, including 0.5-mm pitch Alloy 42 thin small-outline packages (TSOPs) and large, 25-mil pitch devices. The ...
Tópico(s): Probabilistic and Robust Engineering Design
1993 - Institute of Electrical and Electronics Engineers | IEEE Transactions on Components Hybrids and Manufacturing Technology
Minoru MUKAI, Takashi Kawakami, Kuniaki Takahashi, Kikuo KISHIMOTO, Tosikaz SHIBUYA,
... carried out for solder joints in a TSOP (thin small outline package). It was shown that the increase in creep ...
Tópico(s): Fatigue and fracture mechanics
1997 - Japan Society Mechanical Engineers | TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
... of temperature. The procedures are implemented for various thin small outline packages (TSOPs) a plastic ball grid array (PBGA) package, ...
Tópico(s): Adhesion, Friction, and Surface Interactions
1996 - Institute of Electrical and Electronics Engineers | IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Chien-Chang Pei, Sheng‐Jye Hwang,
... for three-dimensional (3D) mold-filling analysis. A thin small outline package (TSOP) with 53 wires is used as the ...
Tópico(s): 3D IC and TSV technologies
2004 - ASM International | Journal of Electronic Packaging
The reliability and the solderability of thin small outline package (TSOP) are significantly affected by the warpage that is generated after epoxy molding compound (EMC) molding process. This warpage problem mainly results ...
Tópico(s): Mechanical Behavior of Composites
2004 - Elsevier BV | Microelectronics Reliability
Ji‐Cheng Lin, Kuo‐Ning Chiang,
Abstract This research proposed a novel ceramic thin‐small‐outline package (Ceramic‐TSOP or C‐TSOP) to meet the high thermal performance and long‐term reliability considerations for today's low‐pin‐count, high‐ ...
Tópico(s): Silicon Carbide Semiconductor Technologies
2001 - Taylor & Francis | Journal of the Chinese Institute of Engineers
Durn‐Yuan Huang, Huei‐Huang Lee, Sheng‐Jye Hwang, Fengmin Su,
... a methodology to simulate the molding process of thin small outline packages (TSOPs) and to predict the paddle shift caused ...
Tópico(s): 3D IC and TSV technologies
2000 - Institute of Electrical and Electronics Engineers | IEEE Transactions on Components and Packaging Technologies
... free electronic assemblies under thermal cycling was investigated. Thin small outline package (TSOP) devices with FeNi leads were reflow soldered ...
Tópico(s): Intermetallics and Advanced Alloy Properties
2007 - Elsevier BV | Journal of Alloys and Compounds
Shiang-Yu Teng, Sheng‐Jye Hwang,
... of thermal expansion of the component materials. The thin small outline package (TSOP) DBS-27P and low-profile quad flat ...
Tópico(s): Epoxy Resin Curing Processes
2006 - ASM International | Journal of Electronic Packaging
Weiqiang Wang, Michael Osterman, Diganta Das, Michael Pecht,
... strength of solder joints with SAC solder refinished thin small outline packages (TSOPs) was evaluated by the shear test. The ...
Tópico(s): Advanced Welding Techniques Analysis
2011 - Institute of Electrical and Electronics Engineers | IEEE Transactions on Components Packaging and Manufacturing Technology
... been developed. This system comprised an indirect incidence thin small outline package (TSOP) based infrared (IR) sensor for sensing flow ...
Tópico(s): Smart Agriculture and AI
2018 - Elsevier BV | Computers and Electronics in Agriculture
M. Onodera, Yasuhiro SHINMA, Kouichi MEGURO, Junji Tanaka, Junichi Kasai,
... conventional Cu wire. The reliability of a TSOP (thin small outline package) that was assembled using an actual semiconductor device ...
Tópico(s): 3D IC and TSV technologies
2008 - Japan Institute of Electronics Packaging | Journal of The Japan Institute of Electronics Packaging
П.В. Никитин, K. V. Rao, Ricardo Martínez, S.F. Lam,
... NXP UCODE G2XM and Impinj Monza 2) in thin-shrink small outline packages. The results have been verified using two chip ...
Tópico(s): 3D IC and TSV technologies
2009 - IEEE Microwave Theory and Techniques Society | IEEE Transactions on Microwave Theory and Techniques