Tzyy‐Sheng Horng, Sung-Mao Wu, Chi-Tsung Chiu, Chih-Pin Hung,
... S-parameter measurement. When compared to the standard thin shrink small outline packages (TSSOPs), BCC packages show much smaller parasitics in ...
Tópico(s): Electronic Packaging and Soldering Technologies
2001 - Institute of Electrical and Electronics Engineers | IEEE Transactions on Advanced Packaging
Tzyy‐Sheng Horng, Sung-Mao Wu, Chih‐Cheng Shih,
... A real example on modeling a 16-lead Thin Shrink Small Outline Package (TSSOP) has been demonstrated. The established model can ...
Tópico(s): 3D IC and TSV technologies
2001 - Institute of Electrical and Electronics Engineers | IEEE Transactions on Advanced Packaging
Tae-Yong Park, Jong‐Chan Park, Hyun-Ung Oh,
... a plastic ball grid array (PBGA) and a thin-shrink small outline package (TSSOP) under launch random vibration excitation. Random vibration ...
Tópico(s): Advanced MEMS and NEMS Technologies
2018 - Elsevier BV | International Journal of Fatigue
П.В. Никитин, K. V. Rao, Ricardo Martínez, S.F. Lam,
... NXP UCODE G2XM and Impinj Monza 2) in thin-shrink small outline packages. The results have been verified using two chip ...
Tópico(s): 3D IC and TSV technologies
2009 - IEEE Microwave Theory and Techniques Society | IEEE Transactions on Microwave Theory and Techniques
... Integrated Circuit Package (8L-SOIC) and 14 leads Thin Shrink Small Outline Package (14L-TSSOP) to compare wire bond ability. Analysis, ...
Tópico(s): 3D IC and TSV technologies
2024 - | ECTI Transactions on Electrical Engineering Electronics and Communications
Basavaraj Rabakavi, Saroja V. Siddamal,
... Inline Package (DIP), Small Outline Integrated Circuit (SOIC), Thin Shrink Small Outline Package (TSSOP).With functional test, the proposed tester also ...
Tópico(s): Real-time simulation and control systems
2020 - Advances in Science, Technology and Engineering Systems Journal (ASTESJ) | Advances in Science Technology and Engineering Systems Journal
Antonio R. Sumagpang, Frederick Ray I. Gomez,
... in trim and form (T/F) process. For thin shrink small outline package (TSSOP), top defect incurred during assembly manufacturing was the package chip-out located at the top surface of the package. ...
Tópico(s): Manufacturing Process and Optimization
2019 - | Journal of Engineering Research and Reports
Ma. Chalina S. Cuntapay, Mark Joseph B. Enojas, Harveen Bongao,
... standard operating procedures (SOP) series and heat sink thin shrink small outline package (HTSSOP) series were found successful without any error. ...
Tópico(s): Energy and Environmental Systems
2022 - Institute of Advanced Engineering and Science (IAES) | Indonesian Journal of Electrical Engineering and Computer Science
Bilal Abd-AlRahman, Corey Lewis, Todd M. Simons,
... been developed to isolate broken stitch bonds in thin shrink small outline package (TSSOP) devices. Open circuit failures have occurred in ...
Tópico(s): Industrial Vision Systems and Defect Detection
2004 - | Proceedings - International Symposium for Testing and Failure Analysis
Ji Li, Thomas J. Wasley, Van Duong Ta, Jonathan D. Shephard, Jonathan Stringer, Patrick J. Smith, Emre Esentürk, Colm Connaughton, Russell A. Harris, Robert W. Kay,
... allowing surface mount assembly of 0603 components and thin-shrink small outline packaged integrated circuits. Small 149-µm flip chip ...
Tópico(s): Photopolymerization techniques and applications
2018 - Emerald Publishing Limited | Rapid Prototyping Journal