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Liquid Cooling Devices and Their Materials Selection

2010; Springer Nature; Linguagem: Inglês

10.1007/978-1-4419-7759-5_10

2197-6643

Xingcun Colin Tong,

Heat Transfer and Boiling Studies

Microprocessor power density has been steadily increasing over the past decade due to increases in microprocessor power dissipation and reduction in feature size of the processing central processing unit (CPU) core, where most of the power on a die is generated. This trend is expected to continue into the future, leading to next generation electronics with a power dense core covering a fraction of the total die surface area bounded by regions of reduced power density cache, with localized power densities exceeding 100 W/cm2. Conventional cooling technologies in the electronic industry have limitations on removing these nonuniform, high heat fluxes from the surface of microprocessors. The combination of high heat fluxes with the nonuniformity of heat dissipation requires technologies able to remove large amounts of heat in a spatially and temporally variable manner. These heat removal technologies, which can meet the challenging cooling requirements of next generation electronics, include direct liquid cooling, indirect liquid cooling, heat pipe, liquid–vapor phase change, nonrefrigeration phase change techniques, pool boiling, jet impingement cooling, evaporative spray cooling, and embedded droplet impingement for integrated cooling of electronics (EDIFICE). This chapter will give a brief review on these methods with single or/and two-phase cooling.