The TRON Project
1987; Elsevier BV; Volume: 11; Issue: 6 Linguagem: Inglês
10.1016/0141-9331(87)90479-0
ISSN1872-9436
AutoresKen Sakamura, Richard Sprague,
Tópico(s)Powder Metallurgy Techniques and Materials
ResumoTo improve the reliability of SnBi solder joints, Ag and porous Cu were used as additives to obtain [email protected]/Cu (x = 0, 0.4, 1 wt%) solder joints. The effect of porous Cu addition on the microstructure, IMC layer, shear behavior and hardness of the solder joints during isothermal aging was studied. The experimental results indicate that there are some areas enclosed by Cu frames in the [email protected]/Cu solder joints. Compared with the SnBi-xAg/Cu solder joints, these areas show a more refined microstructure and higher hardness than the other areas do. After being aged at 100 °C for 600 h, the hardness of the solder bulks showed an increasing trend due to the coarsening of the microstructure. The addition of porous Cu improves the shear strength of the SnBi-xAg/Cu solder joints before and after aging. Among them, [email protected]/Cu shows the highest shear strength. After isothermal aging, the shear fracture transferred from the solder bulk to the soldering interface in the SnBi and SnBi-0.4Ag solder joints. The addition of porous Cu has a positive effect on suppressing the crack propagation in the solder joints. Therefore, the fracture position is mainly located in the solder bulks in the [email protected]/Cu solder joint.
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