Artigo Revisado por pares

Interdiffusion at the interface between poly(vinylpyrrolidone) and epoxy

1997; Wiley; Volume: 35; Issue: 2 Linguagem: Inglês

10.1002/(sici)1099-0488(19970130)35

ISSN

1099-0488

Autores

Hideko T. Oyama, John J. Lesko, J. P. Wightman,

Tópico(s)

Polymer Nanocomposites and Properties

Resumo

Journal of Polymer Science Part B: Polymer PhysicsVolume 35, Issue 2 p. 331-346 Article Interdiffusion at the interface between poly(vinylpyrrolidone) and epoxy Hideko T. Oyama, Hideko T. Oyama NSF Science and Technology Center for High Performance Polymeric Adhesives and Composites, Department of Chemistry, Virginia Polytechnic Institute & State University, Blacksburg, Virginia 24061Search for more papers by this authorJ. J. Lesko, J. J. Lesko Department of Engineering Science and Mechanics, Virginia Polytechnic Institute & State University, Blacksburg, Virginia 24061Search for more papers by this authorJ. P. Wightman, Corresponding Author J. P. Wightman NSF Science and Technology Center for High Performance Polymeric Adhesives and Composites, Department of Chemistry, Virginia Polytechnic Institute & State University, Blacksburg, Virginia 24061NSF Science and Technology Center for High Performance Polymeric Adhesives and Composites, Department Chemistry, Virginia Polytechnic Institute & State University, Blacksburg, Virginia 24061Search for more papers by this author Hideko T. Oyama, Hideko T. Oyama NSF Science and Technology Center for High Performance Polymeric Adhesives and Composites, Department of Chemistry, Virginia Polytechnic Institute & State University, Blacksburg, Virginia 24061Search for more papers by this authorJ. J. Lesko, J. J. Lesko Department of Engineering Science and Mechanics, Virginia Polytechnic Institute & State University, Blacksburg, Virginia 24061Search for more papers by this authorJ. P. Wightman, Corresponding Author J. P. Wightman NSF Science and Technology Center for High Performance Polymeric Adhesives and Composites, Department of Chemistry, Virginia Polytechnic Institute & State University, Blacksburg, Virginia 24061NSF Science and Technology Center for High Performance Polymeric Adhesives and Composites, Department Chemistry, Virginia Polytechnic Institute & State University, Blacksburg, Virginia 24061Search for more papers by this author First published: 07 December 1998 https://doi.org/10.1002/(SICI)1099-0488(19970130)35:2 3.0.CO;2-JCitations: 22AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onFacebookTwitterLinkedInRedditWechat Abstract Electron microprobe analysis (EMP) was used to study interdiffusion in bilayer films of thermoplastic poly(vinylpyrrolidone) (PVP) and a thermoset epoxy. The bilayer films were prepared by casting a stoichiometric mixture of the uncured diglycidyl ether of bisphenol A epoxy (DGEBA) and 4,4′-diaminodiphenylsulfone (DDS) on the PVP film and then curing the system in a two-step process under a nitrogen atmosphere. For the EMP studies, the sulfur signal was used as a probe for DDS, while the nitrogen signal served as a probe for both DDS and PVP. The addition of brominated DGEBA to the conventional DGEBA in a 1: 1 weight ratio allowed the bromine signal to be used as a probe for the epoxy phase. It was found that the interfacial thickness was much larger for the film prepared from low molecular weight PVP than that from high molecular weight PVP. Interdiffusion was suppressed when the initial cure temperature in the two-step cure cycle was 130°C compared to 170°C, in which the first stage of the cure reaction dominated the interdiffusion process. More importantly, it was demonstrated that the diffusion front of the curing agent was located closer to the thermoplastic polymer phase as compared to that of the thermoset polymer in the interface region. This tendency was more significant in the system with the larger interfacial thickness. These results have important consequences on interphase structures and properties. They suggest that crosslinking of the epoxy in the interphase may be suppressed because of an insufficient amount of curing agent and that the not-fully-reacted curing agent in the PVP phase may act to plasticize this phase. © 1997 John Wiley & Sons, Inc. Citing Literature Volume35, Issue230 January 1997Pages 331-346 RelatedInformation

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