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<title>Optoelectronic scalable substrates based on film/Z-connection and its application to film optical link module (FOLM)</title>

2000; SPIE; Volume: 3952; Linguagem: Inglês

10.1117/12.384398

1996-756X

Tetsuzo Yoshimura, James Roman, Yasuhito Takahashi, Michael Lee, B. Chou, S.I. Beilin, Wen-Chou V. Wang, M. Inao,

Photonic and Optical Devices

We propose a new concept of optoelectronic (OE) interconnect hardware 'OE Scalable Substrate (OE-SS)' and 'Film Optical Link Module (FOLM)', which have potentiality to remove optics excess. The structure is as follows: OE-films, in which waveguides, thin-film OE devices, LSIs, capacitor chips etc. are integrated with via/pad/electrode, are stacked by electrical joints (Z-connections). This gives rise to standardized-interface capability and scalability. Using one basic technology 'film/Z-connection', all levels of interconnection will be achieved, including massive parallel optical link, inter-board optical connect, and 3D- stack-OE-MCM. We prose a new process 'Device Integration with Self-Organizing Transfer', which is essential for low- cost OE-SS and FOLM, especially for WDM applications.