Novel interconnection technologies for integrated microfluidic systems
1999; Elsevier BV; Volume: 77; Issue: 1 Linguagem: Inglês
10.1016/s0924-4247(99)00185-5
ISSN1873-3069
AutoresBonnie L. Gray, D. Jaeggi, Nicholas J. Mourlas, B.P. van Drieënhuizen, K.R. Williams, N.I. Maluf, G.T.A. Kovacs,
Tópico(s)Electrowetting and Microfluidic Technologies
ResumoA new approach to realize silicon based integrated microfluidic systems is presented. By using a combination of silicon fusion bonding (SFB) and deep reactive ion etching (DRIE), multi-level fluidic `circuit boards' are fabricated and used to integrate microfluidic components into hybrid systems. A multi-level laminating mixer and a manifold with multiple pressure sensors are presented as application examples. To interface the microfluidic system to the macroscopic world, three types of DRIE-fabricated, tight-fitting fluidic couplers for standard capillary tubes are described. One type of coupler is designed for minimal dead space, while another type reduces the risk of blocking capillaries with adhesive. A third design demonstrates for the first time a silicon/plastic coupler combining DRIE coupler technology with injection-molded press fittings.
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