Revisiting mechanisms to inhibit Ag3Sn plates in Sn–Ag–Cu solders with 1wt.% Zn addition
2010; Elsevier BV; Volume: 500; Issue: 1 Linguagem: Inglês
10.1016/j.jallcom.2010.03.191
ISSN1873-4669
AutoresZhongbing Luo, Jie Zhao, Y.-J. Gao, L. Wang,
Tópico(s)Intermetallics and Advanced Alloy Properties
ResumoTwo mechanisms to inhibit Ag3Sn plates were discovered in Sn–1.0Ag–0.5Cu and Sn–3.0Ag–0.5Cu with 1 wt.% Zn addition. It was revealed that 1 wt.% Zn not only reduced the supercooling of β-Sn, but also promoted the formation of γ-(Cu,Ag)5Zn8 compounds. The amount of γ-(Cu,Ag)5Zn8 was larger in Sn–3.0Ag–0.5Cu than that in Sn–1.0Ag–0.5Cu. Meanwhile, the Ag content in γ-(Cu,Ag)5Zn8 was higher in the high-Ag solder. Although more γ particles formed under slow cooling rate, the Ag content varied a little with cooling rate.
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