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Growth of Co/Cu multilayered thin films by electro-deposition

2004; Wiley; Volume: 201; Issue: 8 Linguagem: Inglês

10.1002/pssa.200304643

1521-396X

Yasunori Hayashi, C. G. Lee, Bon Heun Koo, Tsuneyuki Sato, Makoto Arita, M. Masuda,

Copper-based nanomaterials and applications

physica status solidi (a)Volume 201, Issue 8 p. 1658-1661 Original Paper Growth of Co/Cu multilayered thin films by electro-deposition Y. Hayashi, Corresponding Author Y. Hayashi [email protected] Department of Metallurgy and Materials Science, Changwon National University, Sarim-Dong, Changwon, 641-773, KoreaTel. +82 55 279 7535, Fax. +82 55 261 7017Search for more papers by this authorC.-G. Lee, C.-G. Lee Department of Metallurgy and Materials Science, Changwon National University, Sarim-Dong, Changwon, 641-773, KoreaSearch for more papers by this authorB.-H. Koo, B.-H. Koo Department of Metallurgy and Materials Science, Changwon National University, Sarim-Dong, Changwon, 641-773, KoreaSearch for more papers by this authorT. Sato, T. Sato Department of Materials Science and Engineerin, Kyushu University, Fukuoka 812-8581, JapanSearch for more papers by this authorM. Arita, M. Arita Department of Materials Science and Engineerin, Kyushu University, Fukuoka 812-8581, JapanSearch for more papers by this authorM. Masuda, M. Masuda Department of Materials Science and Engineerin, Kyushu University, Fukuoka 812-8581, JapanSearch for more papers by this author Y. Hayashi, Corresponding Author Y. Hayashi [email protected] Department of Metallurgy and Materials Science, Changwon National University, Sarim-Dong, Changwon, 641-773, KoreaTel. +82 55 279 7535, Fax. +82 55 261 7017Search for more papers by this authorC.-G. Lee, C.-G. Lee Department of Metallurgy and Materials Science, Changwon National University, Sarim-Dong, Changwon, 641-773, KoreaSearch for more papers by this authorB.-H. Koo, B.-H. Koo Department of Metallurgy and Materials Science, Changwon National University, Sarim-Dong, Changwon, 641-773, KoreaSearch for more papers by this authorT. Sato, T. Sato Department of Materials Science and Engineerin, Kyushu University, Fukuoka 812-8581, JapanSearch for more papers by this authorM. Arita, M. Arita Department of Materials Science and Engineerin, Kyushu University, Fukuoka 812-8581, JapanSearch for more papers by this authorM. Masuda, M. Masuda Department of Materials Science and Engineerin, Kyushu University, Fukuoka 812-8581, JapanSearch for more papers by this author First published: 04 June 2004 https://doi.org/10.1002/pssa.200304643Citations: 5AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onEmailFacebookTwitterLinkedInRedditWechat Abstract Electrochemical method has been applied for preparing Co/Cu multilayered thin films. The layers were electrodeposited after injecting Co and Cu containing solutions in a flow exchanged supporting electrolyte solution. In X-ray diffraction at low angle range a long period peak could be observed, and in the middle angle region a single broad peak showing an average lattice spacing of the film was observed. The electrical resistance showed the properties of Giant Magnetoresistance (GMR). The GMR ratio showed a variation against Cu layer thickness as expected for anti-ferromagnetically coupled films. The maximum GMR ratio obtained in this study was 6.2% at room temperature for the film of [Co 2.0 nm/Cu 1.0 nm]15. Though we need further studies for choosing suitable deposition conditions, the electrodeposition method is a promising method for producing multilayered thin films. 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