Portal de Periódicos da CAPES

Interfacial reactions of Pb-free solders with Au/Pd/Ni/brass multilayer substrates

2011; Elsevier BV; Volume: 517; Linguagem: Inglês

10.1016/j.jallcom.2011.12.046

1873-4669

Yee‐Wen Yen, Po-Hao Tsai, Yang-kai Fang, Binbin Chen, Chiapyng Lee,

Intermetallics and Advanced Alloy Properties

Abstract The interfacial reactions of Sn, Sn–3.0 wt% Ag–0.5 wt% Cu (SAC), Sn–0.7 wt% Cu (SC), Sn–58 wt% Bi (SB) and Sn–9 wt% Zn (SZ) lead-free solders with an Au/Pd/Ni/brass multilayer substrate were systematically investigated in this study. The results revealed that (Cu, Ni)6Sn5 and CuZn phases were formed at the interface in the Sn, SAC, and SC solders reacting with Au/Pd/Ni/brass systems. In the SB/Au/Pd/Ni/brass system, (Ni, Cu)3Sn4, (Cu, Ni)6Sn5 and CuZn phases were formed at the interface. The CuZn5, Pd2Zn9, Ni5Zn21 and Cu5Zn8 phases were formed in the SZ/Au/Pd/Ni/brass system.