Grain boundary groove evolutions by surface self-diffusion on a plane and on a wire
1976; Elsevier BV; Volume: 57; Issue: 1 Linguagem: Inglês
10.1016/0039-6028(76)90176-x
ISSN1879-2758
AutoresVu Thien Binh, M Chaudier, J.C Couturier, R. Uzan, M. Drechsler,
Tópico(s)Magnetic properties of thin films
ResumoExperiments on the evolution of the profile of metallic filaments of small diameter and tips show certain discrepancies with the known theoretical descriptions of grainboundaries grooving. According to our hypothesis, these discrepancies are due to the fact that the former calculations were made only for the case of a plane and not for a cylindric surface. Therefore, using a modified method we have calculated the grooving evolution for a plane as well as for a wire. The main results for a plane are more or less in accordance with former calculations. The main results for a wire are: (a) the groove profile evolution is not any more steady-state; (b) the groove depth increases more rapidly han in the case of a plane; (c) the mean groove angle is not any more constant, but varies with time (while the difficult observable equilibrium angle stays constant); (d) the profile evolution leads to a new phenomenon: the wire will be divided into two parts only by surface migration. Electron microscope observations of groove shapes on wires and tip shanks, are qualitatively in agreement with the presented calculated results.
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