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Thin-film machining by laser-induced explosion

1977; American Institute of Physics; Volume: 31; Issue: 9 Linguagem: Inglês

10.1063/1.89801

1520-8842

V. J. Zaleckas, Jackson C. Koo,

Advanced machining processes and optimization

This paper describes a process for the laser machining of thin metallic films on dielectric substrates. The observation of a distinct minimum in the machining threshold and the fact that no substrate damage occurs over a wide range of incident power are explained based on an explosive film-removal mechanism. Experimental results supporting the predictions are presented.