Portal de Periódicos da CAPES

Effects of Rework on the Reliability of Pin Grid Array Interconnects

1991; Emerald Publishing Limited; Volume: 17; Issue: 4 Linguagem: Inglês

10.1108/eb046140

1758-602X

John H. Lau, S. Leung, R. Subrahmanyan, D. Rice, S. Erasmus, Chun Li,

Aluminum Alloys Composites Properties

In this study, the reliability of solder joints and plated‐through hole copper pads/barrels of pin grid array assemblies under rework condition has been determined by fatigue experiments. The cross‐sections of the re‐worked PGA assemblies (before and after fatigue tests) are also provided for a better understanding of the failure mechanisms of the composite structure. Furthermore, the load‐drop curves of the PGA interconnects for up to three reworks are provided for a better estimate of their fatigue life.