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Photonic–Electronic Integration With Bonding

2014; IEEE Photonics Society; Volume: 20; Issue: 4 Linguagem: Inglês

10.1109/jstqe.2013.2295713

1558-4542

Jean-Marc Fédéli, Franz Schrank, E. Augendre, Stéphane Bernabé, Jochen Kraft, Philippe Grosse, T. Enot,

3D IC and TSV technologies

By co-integrating optics and electronics on the same chip, high-functionality, high-performance and highly integrated devices can be fabricated with a well-mastered microelectronics fabrication process. Different integration schemes with bonding are presented either with die-to-wafer or wafer to wafer bonding. Depending of the applications and the maturity level of the technologies, the strategies for integration will differ.