Interface engineering between metal electrode and GeO2 dielectric for future Ge-based metal-oxide-semiconductor technologies
2012; American Institute of Physics; Volume: 101; Issue: 20 Linguagem: Inglês
10.1063/1.4766745
ISSN1520-8842
AutoresShingo Ogawa, Iori Hideshima, Yuya Minoura, Takashi Yamamoto, Asami Yasui, Hiroaki Miyata, Kosuke Kimura, Toshihiko Ito, Takuji Hosoi, Takayoshi Shimura, Heiji Watanabe,
Tópico(s)Silicon Nanostructures and Photoluminescence
ResumoInterfacial reactions between a metal-gate electrode and GeO2 dielectric in Ge-based metal-oxide-semiconductor (MOS) devices have been investigated by several analytical techniques, and we have demonstrated a method to suppress the interfacial reactions. Although no reaction occurs at the Au/GeO2 interface, a significant reaction was observed at the Al/GeO2 interface, which leads to increases in the leakage current and defect states in an MOS capacitor. While Al is oxidized at the Al/GeO2 interface, GeO2 is reduced to form Ge-Ge and Ge-Al bonding units during the early stage of the Al deposition. Moreover, the Ge-Al alloy segregates to the Al-electrode surface during the sequent Al deposition. These interfacial reactions are dramatically suppressed by insertion of ultrathin Al2O3 into the Al/GeO2 interface.
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