Artigo
A Path to 300 mm Hybrid Silicon Photonic Integrated Circuits
2014; Linguagem: Inglês
10.1364/ofc.2014.th1c.1
AutoresJ. E. Bowers, Jock Bovington, A. Y. Liu, A. C. Gossard,
Tópico(s)Optical Network Technologies
ResumoWe describe recent advances in hybrid silicon components and photonic integrated circuits. We present a path towards scalable, ultralow cost photonic integrated circuits (PICs) on 300 mm silicon substrates.
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