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In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints

2011; American Institute of Physics; Volume: 110; Issue: 12 Linguagem: Inglês

10.1063/1.3671404

1520-8850

Fan-Yi Ouyang, Chin-Li Kao,

Semiconductor materials and interfaces

In this study, we investigated the phenomenon of thermomigration in 96.5Sn-3Ag-0.5Cu flip chip solder joints at an ambient temperature of 150 °C. We observed mass protrusion on the chip side (hot end), indicating that Sn atoms moved to the hot end, and void formation on the substrate side (cold end). The diffusion markers also moved to the substrate side, in the same direction of the vacancy flux, indicating that the latter played a dominant role during the thermomigration process. The molar heat of transport (Q*) of the Sn atoms was 3.38 kJ/mol.