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Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys

2007; Elsevier BV; Volume: 17; Issue: 4 Linguagem: Inglês

10.1016/s1003-6326(07)60178-2

2210-3384

Xiaoyan Zhao, Maiqun Zhao, Xiaoqing Cui, Tong Ming-xin,

Metallurgical and Alloy Processes

The melting point, spreading property, mechanical properties and microstructures of Sn-3.0Ag-2.8Cu solder alloys added with micro-variable-Ce were studied by means of optical microscopy, scanning electron microscopy(SEM) and energy dispersive X-ray(EDX). The results indicate that the melting point of Sn-3.0Ag-2.8Cu solder is enhanced by Ce addition; a small amount of Ce will remarkably prolong the creep-rupture life of Sn-3.0Ag-2.8Cu solder joint at room temperature, especially when the content of Ce is 0.1%, the creep-rupture life will be 9 times or more than that of the solder joint without Ce addition; the elongation of Sn-3.0Ag-2.8Cu solder is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%–0.1%.