Surface modification-assisted bonding of polymer-based microfluidic devices
2009; Elsevier BV; Volume: 143; Issue: 2 Linguagem: Inglês
10.1016/j.snb.2009.10.001
ISSN1873-3077
AutoresYolanda H. Tennico, Myra T. Koesdjojo, Saki Kondo, David Mandrell, Vincent T. Remcho,
Tópico(s)Advanced Sensor and Energy Harvesting Materials
ResumoThis paper reports on the development and application of a surface modification technique as an improved method for bonding polymer microfluidic substrates. This technique readily produced complete microfluidic chips via plasma oxidation followed by silane reagent treatment on the polymer surface. Characterization of the bonded chips was performed using scanning electron microscopy (SEM), water contact angle measurement, and tensile strength measurement. SEM images showed that the integrity of the channel features was successfully preserved. A bond strength approaching that of solvent welding was demonstrated. This technique has been successfully applied to bond dissimilar polymer substrates (polymethylmethacrylate (PMMA), amorphous polyethylene terephthalate (APET), polycarbonate (PC)), and is also applicable to bonding a hard polymer substrate to polydimethylsiloxane (PDMS) or glass.
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