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Thermal Stress Failure of Porcelain Bonded to a Palladium-Silver Alloy

1985; SAGE Publishing; Volume: 64; Issue: 3 Linguagem: Inglês

10.1177/00220345850640031801

1544-0591

Terry Walton, William J. O’Brien,

Advanced Materials and Mechanics

Cracking or rupturing, due to thermal stress, of porcelain bonded to a palladium-silver alloy indicated that porcelain-metal thermal compatibility was dependent on: the difference in thermal expansion coefficients of the porcelain and metal; the geometry and dimensions of the samples; and the porcelain-metal thickness ratio. A spherical configuration was more sensitive to thermal expansion coefficient differences than was a disc configuration. A higher incidence of cracking resulted from an increase in both specimen size and porcelain-metal thickness ratio.