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An Effective Lift‐Off Method for Patterning High‐Density Gold Interconnects on an Elastomeric Substrate

2010; Wiley; Volume: 6; Issue: 24 Linguagem: Inglês

10.1002/smll.201001456

1613-6829

Liang Guo, Stephen P. DeWeerth,

Conducting polymers and applications

High-resolution, high-density gold interconnects are effectively patterned on an elastomeric substrate. A 3 cm cable of ten gold wires with 10 μm width and 20 μm pitch is achieved, successfully demonstrating density increases of more than one order of magnitude from previously established work. Many applications in the fields of stretchable electronics and conformable neural interfaces will benefit from these fabrication developments. Detailed facts of importance to specialist readers are published as "Supporting Information". Such documents are peer-reviewed, but not copy-edited or typeset. They are made available as submitted by the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.