Chip-to-chip optical interconnections between stacked self-aligned SOI photonic chips
2012; Optica Publishing Group; Volume: 20; Issue: 7 Linguagem: Inglês
10.1364/oe.20.007886
ISSN1094-4087
AutoresStéphane Bernabé, Christophe Kopp, Marion Volpert, Julie Harduin, Jean-Marc Fédéli, H. Ribot,
Tópico(s)Optical Network Technologies
ResumoPhotonic silicon devices are key enabling technologies for next generation High Performance Computers. In this paper, we report the possibility to stack and optically interconnect SOI based photonic chips for future System-In-Package photonic architecture. Combining vertical grating couplers and state-of-the-art flip-chip technology, we demonstrated low loss penalties and wide spectral range optical interconnections between stacked photonic chips.
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