Portal de Periódicos da CAPES

Investigation of the boron nitride/polybenzoxazine interphase

1999; Wiley; Volume: 37; Issue: 17 Linguagem: Inglês

10.1002/(sici)1099-0488(19990901)37

1099-0488

Mitchell T. Huang, Hatsuo Ishida,

Injection Molding Process and Properties

Journal of Polymer Science Part B: Polymer PhysicsVolume 37, Issue 17 p. 2360-2372 Article Investigation of the boron nitride/polybenzoxazine interphase Mitchell T. Huang, Mitchell T. Huang The NSF Center for Molecular and Microstructure of Composites (CMMC), Department of Macromolecular Science, Case Western Reserve University, Cleveland, Ohio 44106-7202Search for more papers by this authorHatsuo Ishida, Corresponding Author Hatsuo Ishida [email protected] The NSF Center for Molecular and Microstructure of Composites (CMMC), Department of Macromolecular Science, Case Western Reserve University, Cleveland, Ohio 44106-7202The NSF Center for Molecular and Microstructure of Composites (CMMC), Department of Macromolecular Science, Case Western Reserve University, Cleveland, Ohio 44106-7202Search for more papers by this author Mitchell T. Huang, Mitchell T. Huang The NSF Center for Molecular and Microstructure of Composites (CMMC), Department of Macromolecular Science, Case Western Reserve University, Cleveland, Ohio 44106-7202Search for more papers by this authorHatsuo Ishida, Corresponding Author Hatsuo Ishida [email protected] The NSF Center for Molecular and Microstructure of Composites (CMMC), Department of Macromolecular Science, Case Western Reserve University, Cleveland, Ohio 44106-7202The NSF Center for Molecular and Microstructure of Composites (CMMC), Department of Macromolecular Science, Case Western Reserve University, Cleveland, Ohio 44106-7202Search for more papers by this author First published: 03 August 1999 https://doi.org/10.1002/(SICI)1099-0488(19990901)37:17 3.0.CO;2-VCitations: 58AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onEmailFacebookTwitterLinkedInRedditWechat Abstract The influence of a hexagonal boron nitride powder surface on the polymerization of a benzoxazine monomer is examined by differential scanning calorimetry (DSC). By varying the thickness of the benzoxazine coatings on boron nitride particles, a distinct influence of the surface substrate on the polymerization reaction could be observed. At a coating thickness calculated to be on the order of a monolayer, the heat of reaction is reduced, while the exothermic peak temperature and peak width at half height are increased relative to that of the neat resin values. The reduced heat of reaction and increased exothermic peak temperature indicate that the boron nitride surface is inhibiting the benzoxazine polymerization reaction. In the intermediate coating thickness region, the heat of reaction increases and the exothermic peak temperature and peak width at half height decrease with increasing coating thickness. With even thicker coatings, the heat of reaction and exothermic peak temperature and peak width at half height reach values corresponding to that of the neat resin and no longer change with thickness. In addition, the influence of surface treated boron nitride particles on the thermal polymerization behavior, as well as the effect of the surface treatment on the viscosity, dynamic mechanical properties, and flexural properties of the filled composites are also investigated. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 2360–2372, 1999 REFERENCES AND NOTES 1 Siebold, R. W.; Lamoureux, R. T.; Goodman, S. H. Mat Res Soc Symp Proc 1988, 108, 141. 2 Manzione, L. T. Plastic Packaging of Microelectronic Devices; Van Nostrand Reinhold: New York, 1990. 3 Tracy, D.; Nguyen, L.; Giberti, R.; Gallo, A.; Bischof, C.; Sweet, J. N.; Hsia, A. W. In Proceedings of the 47th Electronic Components and Technology Conference; IEEE, 1997; p 72. 4 Hill, R. F. In Proceedings of the Technical Program of the SMTA National Symposium—Emerging Packaging Technologies; Research Triangle Park, NC, 1996. 5 Chung, D. D. L.; Li, L. In Materials for Electronic Packaging; D. D. L. Chung, Ed.; Butterworth-Heinemann: Boston, 1995, p 169. 6 Proctor, P.; Solc, J. In Proceedings of the 41st Electronic Components and Technology Conference; IEEE, 1991; p 835. 7 Chen, A. S.; Lo, R. H. Y. In Proceedings of the 46th Electronic Components and Technology Conference; IEEE, 1996; p 599. 8 Koh, W. H. In Proceedings of the 46th Electronic Components and Technology Conference; IEEE, 1996; p 343. 9 Gallo, A. A.; Bischof, C. S.; Howard, K. E.; Dunmead, S. D.; Anderson, S. A. In Proceedings of the 46th Electronic Components and Technology Conference; IEEE, 1996; p 335. 10 Bujard, P. In Proceedings of the Intersociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components, 1988; p 41. 11 Bujard, P.; Kuhnlein, G.; Ino, S.; Shiobara, T. In Proceedings of the 44th Electronic Components and Technology Conference; IEEE, 1994; p 159. 12 Hatta, H.; Taya, M.; Kulacki, F. A.; Harder, J. F. J Comp Mater 1992, 26, 612. 13 Tsutsumi, N.; Takeuchi, N.; Kiyosukuri, T. J Polym Sci, Polym Phys Ed 1991, 29, 1085. 14 Vagberg, L.; De Potocki, P.; Stenius, P. Appl Spectrosc 1989, 43, 1240. 15 Boiara, M. S.; Chaffey, C. E. Polym Eng Sci 1977, 17, 715. 16 Rochette, A.; Choplin, L.; Tanguy, P. A. Polym Compos 1988, 9, 419. 17 Bajaj, P.; Jha, N. K.; Kumar, R. A. J Appl Polym Sci 1992, 44, 1921. 18 Chiang, W. Y.; Yang, W. D.; Pukanszky, B. Polym Eng Sci 1994, 24, 485. 19 Ishida, H.; Allen, D. J. J Polym Sci, Polym Phys Ed 1996, 34, 1019. 20 Ning, X.; Ishida, H. J Polym Sci, Polym Phys Ed 1994, 32, 921. 21 Ishida, H.; Allen, D. J. Polymer 1996, 37, 4487. 22 Ishida, H.; Rodriguez, Y. J Appl Polym Sci 1995, 58, 1751. 23 Kim, H. J.; Brunovska, Z.; Ishida, H. submitted. 24 Hammond, L. Advanced Ceramics Corporation, Cleveland, Ohio, personal communication, 1996. 25 Huang, M. T.; Ishida, H. J Phys Chem, in press. 26 Ishida, H. U.S. Patent 5,543,516, 1996. 27 Ning, X.; Ishida, H. J Polym Sci, Polym Chem 1994, 32, 1121. 28 Berthod, H.; Pullman, A. J Chem Phys 1965, 62, 942. 29 Prime, R. B. In Thermal Characterization of Polymeric Materials; E. A. Turi, Ed.; Academic Press: New York, 1981; p 519. 30 Willard, P. E. J Macromol Sci-Chem 1974, A8, 33. 31 Dutta, A.; Ryan, M. E. J Appl Polym Sci 1979, 24, 635. 32 Bajaj, P.; Jha, N. K.; Kumar, R. A. J Appl Polym Sci 1990, 40, 203. 33 Xu, R.; Schreiber, H. P.; Huang, M. T.; Ishida, H. J Polym Sci B: Polym Phys, in press. 34 Liu, J.; Ishida, H. In Polymeric Materials Encyclopedia; J. C. Salamone, Ed.; CRC Press: New York, 1996; Vol. 1, p 484. 35 Higginbottom, H. P. U.S. Patent 4,501,864, 1985. 36 Higginbottom, H. P. U.S. Patent 4,557,979, 1985. 37 Mansfield, K. F.; Theodorou, D. N. Macromolecules 1991, 24, 4295. 38 Theodorou, D. N. Macromolecules 1989, 22, 4589. 39 Lipatov, Y. S.; Moisya, E. G.; Semenovich, G. M. Polymer 1975, 16, 582. 40 Petrovic, Z.; Stojakovic, N. Polym Compos 1988, 9, 42. 41 Wang, Y.; Xu, X. Compos Interfaces 1993, 1, 167. 42 Riess, G.; Schwob, J. M.; Guth, G.; Roche, M.; Laude, B. In Advances in Polymer Synthesis; B. M. Culbertson; J. E. McGrath, Eds.; Plenum Press: New York, 1986; p 27. 43 Malik, T. M.; Carreau, J.; Grmela, M.; Dufresne, A. Polym Compos 1988, 9, 412. 44 Plueddemann, E. P.; Stark, G. L. In Additives for Plastics; R. B. Seymour, Ed.; Academic Press: New York 1978, Vol. 2, p 49. 45 Zhang, J. G.; Edirisinghe, M. J.; Evans, J. R. G. J Mater Sci 1988, 23, 2115. 46 Schreiber, H. P.; Wertheimer, M. R.; Lambla, M. J Appl Polym Sci 1982, 27, 2269. 47 Schreiber, H. P.; Viau, J. M.; Fetoui, A.; Deng, Z. Polym Eng Sci 1990, 30, 263. 48 Han, C. D.; Van Den Weghe, T.; Shete, P.; Haw, J. R. Polym Eng Sci 1981, 21, 196. 49 Han, C. D.; Sandford, C.; Yoo, H. J. Polym Eng Sci 1978, 18, 849. 50 Fowkes, F. M. In Encyclopedia of Polymer Science and Engineering; H. F. Mark; N. M. Bikales; C. G. Overberger; G. Menges; J. I. Kroschwitz, Eds.; John Wiley & Sons: New York, 1989; Suppl. Vol., p 1. 51 Marmo, M. J.; Mostafa, M. A.; Jinnai, H.; Fowkes, F. M.; Manson, J. A. Ind Eng Chem Prod Res Dev 1976, 15, 206. 52 Mukhopadhyay, P.; Schreiber, H. P. Colloids Surfaces A, Physicochem Eng Aspects 1995, 100, 47. 53 Labronici, M. Ph.D. Thesis, Case Western Reserve University, 1994. 54 Gerard, J. F. Polym Eng Sci 1988, 28, 568. 55 Ward, I. M. Mechanical Properties of Solid Polymers; 2nd ed.; John Wiley & Sons: New York, 1983; p 144. 56 Roulin-Maloney, A. C.; Cantwell, W. J.; Kausch, H. H. Polym Compos 1987, 8, 314. Citing Literature Volume37, Issue171 September 1999Pages 2360-2372 ReferencesRelatedInformation