P-62: Latest Developments In Polyester Film For Flexible Electronics
2005; Wiley; Volume: 36; Issue: 1 Linguagem: Inglês
10.1889/1.2036488
ISSN2168-0159
AutoresWilliam A. MacDonald, K. Rollins, D. MacKerron, R. Eveson, R. A. Rustin, Mohd Ridhwan Adam, M. Kieran Looney, Taichi Yoshida, Katsuyuki Hashimoto,
Tópico(s)Advanced Materials and Mechanics
ResumoSID Symposium Digest of Technical PapersVolume 36, Issue 1 p. 514-517 P-62: Latest Developments In Polyester Film For Flexible Electronics W. A. MacDonald, W. A. MacDonald DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorK. Rollins, K. Rollins DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorD. MacKerron, D. MacKerron DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorR. Eveson, R. Eveson DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorR. A. Rustin, R. A. Rustin DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorR. Adam, R. Adam DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorM. K. Looney, M. K. Looney DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorT. Yoshida, T. Yoshida DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorK. Hashimoto, K. Hashimoto DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this author W. A. MacDonald, W. A. MacDonald DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorK. Rollins, K. Rollins DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorD. MacKerron, D. MacKerron DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorR. Eveson, R. Eveson DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorR. A. Rustin, R. A. Rustin DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorR. Adam, R. Adam DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorM. K. Looney, M. K. Looney DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorT. Yoshida, T. Yoshida DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this authorK. Hashimoto, K. Hashimoto DuPont Teijin Films, PO Box 2002, Wilton, Middlesbrough, UK, TS90 8JFSearch for more papers by this author First published: 05 July 2012 https://doi.org/10.1889/1.2036488Citations: 10AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onFacebookTwitterLinkedInRedditWechat Abstract DuPont Teijin Films(DTF) have developed engineered substrates specifically for the flexible electronics market. Teonex ®Q65 is a biaxially oriented crystalline polyester with a tailored surface and it is emerging as a competitive material for the base substrate in OLED displays and active matrix backplanes. To meet the demanding requirements of flexible displays the engineered substrates are likely to be multilayer structures. This contribution will discuss the mechanical properties of multilayer structures on flexing and the impact of the processing environment on dimensional reproducibility. Understanding the influence of these factors is critical to achieving the performance required of substrates for flexible electronic applications. Citing Literature Volume36, Issue1May 2005Pages 514-517 RelatedInformation
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