Microfabricated ultra-thin all-polymer thermal ground planes
2015; Elsevier BV; Volume: 60; Issue: 7 Linguagem: Inglês
10.1007/s11434-015-0760-9
ISSN2095-9281
AutoresRyan Lewis, Li‐Anne Liew, Shanshan Xu, Yung-Cheng Lee, Ronggui Yang,
Tópico(s)Semiconductor materials and devices
ResumoThermal ground planes, or planar heat pipes, can provide highly effective heat transfer by utilizing phase change of an encapsulated fluid. In this article, a flexible thermal ground plane (FTGP) was fabricated using polymer materials. Kapton was employed as a casing material while micropatterned SU-8 was used to provide both a liquid wicking structure and pillars to support the casing over a vapor core. An ultra-thin TiO2 film was deposited over the SU-8 and Kapton via atomic layer deposition, which acted as both a moisture barrier and a hydrophilic coating on polymer surfaces. The assembled FTGP has a thickness of 0.30 mm, an active area of 20 mm × 60 mm, heater area of 20 mm × 10 mm, and can operate with a heat load up to 9.54 W, with an effective thermal conductivity up to 541 W/(m K).
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