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Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish

2010; Springer Science+Business Media; Volume: 39; Issue: 11 Linguagem: Inglês

10.1007/s11664-010-1351-9

ISSN

1543-186X

Autores

Wei Wu, Chih‐Wei Lin, Shubin Huang, Cheng–En Ho,

Tópico(s)

Advanced Welding Techniques Analysis

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