Portal de Periódicos da CAPES

<title>Voltage imaging(TM) for L-contact panel testing</title>

1996; SPIE; Volume: 2651; Linguagem: Inglês

10.1117/12.235345

1996-756X

Ying-Moh Liu, F. Henley, Mike Miller, Jack C. Salerno,

Electronic Packaging and Soldering Technologies

Applications of the Voltage Imaging TM technique in testing active arrays used in AMLCDs have been widely discussed. Voltage Imaging TM is well known for its simplicity in interfacing with active array panels, and its superior voltage measurement accuracy and repeatability. It is also known for having broad test applicability for many AMLCD panel design technologies, such as TFT, MIM, diode and panels with integrated drivers. This paper briefly discusses a recent improvement related to the application of Voltage Imaging TM for L-contact panel testing. As the panel manufacturers are trying to reduce the manufacturing cost, the number of panels on one substrate also increases which, in several cases, leaves only enough room to add ESD protection shorting rings on two of the four sides of a panel. Since this is the trend of the industry, a methodology that can be employed to test L-contact panels with Voltage Imaging TM is presented in this paper.