Design for lead‐free solder joint reliability of high‐density packages
2004; Emerald Publishing Limited; Volume: 16; Issue: 1 Linguagem: Inglês
10.1108/09540910410517013
ISSN1758-6836
AutoresJohn H. Lau, Walter Dauksher, Joe Smetana, Rob Horsley, Dongkai Shangguan, Todd Castello, Irv Menis, Dave Love, Bob Sullivan,
Tópico(s)Aluminum Alloy Microstructure Properties
ResumoThe lead‐free solder joint reliability of several printed circuit board mounted high‐density packages, when subjected to temperature cycling was investigated by finite element modelling. The packages were a 256‐pin plastic ball grid array (PBGA), a 388‐pin PBGA, and a 1657‐pin ceramic column grid array. Emphasis was placed on the determination of the creep responses (e.g. stress, strain, and strain energy density) of the lead‐free solder joints of these packages.
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