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<title>Optoelectronic backplane interconnect technology development (POINT)</title>

1997; SPIE; Volume: 3005; Linguagem: Inglês

10.1117/12.271090

1996-756X

Yung-Sheng Liu, W. B. Hennessy, R.J. Wojnarowski, Julian P. G. Bristow, Yue Liu, John R. Rowlette, Jared D. Stack, James T. Yardley, Louay A. Eldada, Richard M. Osgood, R. Scarmozzino, Shin H. Lee, Susant K. Patra,

3D IC and TSV technologies

This paper describes the technical approach and progresses of the POINT program. This project is a collaborative effort among GE, Honeywell, AMP, AlliedSignal, Columbia University and University of California at San Diego, sponsored by DARPA/ETO to develop affordable optoelectronic packaging and interconnect technologies for board and backplane applications. In this paper, we report the development of a backplane interconnect structure using polymer waveguides to an interconnect length of 280 mm to demonstrate high density and high speed interconnect, and the related technical development efforts on: (a) a high density and high speed VCSEL array packaging technology that employs planar fabrication and batch processing for low-cost manufacturing, (b) passive alignment techniques for reducing recurrent cost in optoelectronic assembly, (c) low-cost optical polymers for board and backplane level interconnects, and (d) CAD tools for modeling multimode guided wave systems and assisting optoelectronic packaging mechanical design.