2-Step algorithm for automatic alignment in wafer dicing process
2004; Elsevier BV; Volume: 44; Issue: 7 Linguagem: Inglês
10.1016/j.microrel.2004.01.005
ISSN1872-941X
AutoresHyong Tae Kim, Chang Song, Hae Jeong Yang,
Tópico(s)Advanced Measurement and Metrology Techniques
ResumoIn this study, automatic alignment algorithm was developed for wafer dicing. Dual inspection method was applied for wafer alignment. The algorithm was derived from inspection data and geometric relations on machine coordinate. The algorithm calculated compensation value which minimized x, y, θ errors. Control strategy was designed according to characteristics of each axis. In experiment, standard position was defined with golden device. When working device was put on stable, it was aligned and moved by compensation value. Alignment error were inspected to check accuracy and precision of the algorithm. Average error was sub-pixel level for y axis on vision coordinate.
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