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Electrically interconnected assemblies of microscale device components by printing and molding

2009; American Institute of Physics; Volume: 95; Issue: 21 Linguagem: Inglês

10.1063/1.3268464

1520-8842

Mo Joon Kim, Jongseung Yoon, Sang-Il Park, John A. Rogers,

Advanced Sensor and Energy Harvesting Materials

This letter presents approaches for assembly and electrical interconnection of micro/nanoscale devices into functional systems with useful characteristics. Transfer printing techniques provide deterministic control over an assembly process that occurs prior to or simultaneously with a soft lithographic molding step that defines relief features in a receiving polymer. Filling these features with conducting materials that are processable in the form of liquids or pastes yields integrated interconnects and contacts aligned to the devices. Studies of the underlying aspects and application to representative systems in photovoltaics and solid state lighting indicators provide insights into the process and its practical use.