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A comparison of the dimple spacing on intergranular creep fracture surfaces with the slip band spacing for copper

1980; Pergamon Press; Volume: 14; Issue: 3 Linguagem: Inglês

10.1016/0036-9748(80)90360-9

1878-2663

T.G. Nieh, William D. Nix,

Microstructure and mechanical properties

We have shown that the dimple spacing on intergranular creep fracture surfaces of copper coincides with the slip band spacing and that both quantities are inversely proportional to the applied stress. This correlation between slip band formation and cavity nucleation suggests that cavities may be nucleated by a process involving the intersection of slip bands and grain boundaries.