Chip cooling with integrated carbon nanotube microfin architectures
2007; American Institute of Physics; Volume: 90; Issue: 12 Linguagem: Inglês
10.1063/1.2714281
ISSN1520-8842
AutoresKrisztián Kordás, Géza Tóth, Pasi Moilanen, M. Kumpumäki, Jouko Vähäkangas, A. Uusimäki, Róbert Vajtai, Pulickel M. Ajayan,
Tópico(s)Thermal properties of materials
ResumoEfficient cooling of silicon chips using microfin structures made of aligned multiwalled carbon nanotube arrays is achieved. The tiny cooling elements mounted on the back side of the chips enable power dissipation from the heated chips on the level of modern electronics demands. The nanotube fins are mechanically superior compared to other materials being ten times lighter, flexible, and stiff at the same time. These properties accompanied with the relative simplicity of the fabrication makes the nanotube structures strong candidates for future on-chip thermal management applications.
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