How fast can cracks move? A research adventure in materials failure using millions of atoms and big computers
2003; Taylor & Francis; Volume: 52; Issue: 8 Linguagem: Inglês
10.1080/00018730310001594198
ISSN1460-6976
Autores Tópico(s)Integrated Circuits and Semiconductor Failure Analysis
ResumoAbstract During the last decade, we have been simulating the dynamic failure of brittle and ductile solids at the atomic level using some of the world's fastest computers. Computer experiments encompassing crack dynamics in brittle fracture, crack blunting in ductile failure, and multi-dislocation entanglement in work-hardening are some examples and have given new and exciting insights into the failure processes of solids. Our presentation begins at an introduction level where basic concepts are presented before their application is needed for the understanding of specific phenomena. The story is primarily based on our past experiences, and our goal is to give the reader a fundamental appreciation for how materials fail. Acknowledgements I am indebted to my large number of co-authors. In particular, Huajian Gao, MPI Stuttgart, has been an indispensable colleague in my materials failure studies. I acknowledge the generous support provided by the Humboldt Research Award for Senior US Scientists. The simulations were carried out in the Max Planck Society Supercomputer Center in Munich, the Lawrence Livermore National Laboratory ASCI White Supercomputer Center, the San Diego Supercomputer Center, and the Cornell Theory Center. Notes * E-mail: farid@almaden.ibm.com †I am grateful to Huajian Gao for this contribution. Additional informationNotes on contributorsFarid F. AbrahamFootnote* * E-mail: farid@almaden.ibm.com
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