Artigo Revisado por pares

Effects of hydrogen plasma pretreatment on characteristics of copper film deposited by remote plasma CVD using (hfac)Cu(TMVS)

2000; Elsevier BV; Volume: 375; Issue: 1-2 Linguagem: Inglês

10.1016/s0040-6090(00)01255-4

ISSN

1879-2731

Autores

Jong‐Hyun Lee, Jeong‐Hwan Lee, Kiju Hwang, Jung‐Yeul Kim, Chang‐Gil Suk, Sie-Young Choi,

Tópico(s)

Semiconductor materials and devices

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