Effects of hydrogen plasma pretreatment on characteristics of copper film deposited by remote plasma CVD using (hfac)Cu(TMVS)
2000; Elsevier BV; Volume: 375; Issue: 1-2 Linguagem: Inglês
10.1016/s0040-6090(00)01255-4
ISSN1879-2731
AutoresJong‐Hyun Lee, Jeong‐Hwan Lee, Kiju Hwang, Jung‐Yeul Kim, Chang‐Gil Suk, Sie-Young Choi,
Tópico(s)Semiconductor materials and devices
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