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Electroless Copper Plating onto Printed Lines of Nanosized Silver Seeds

2007; Electrochemical Society; Volume: 10; Issue: 3 Linguagem: Inglês

10.1149/1.2431241

1944-8775

Chen‐Yu Kao, Kan‐Sen Chou,

Electrodeposition and Electroless Coatings

It was demonstrated that continuous copper films could be grown onto printed lines of nanosized silver colloids. These silver colloids, with an average size of , were printed on alumina substrates by either an ink-jet printer or a felt-tip pen and then served as a seed layer for subsequent electroless copper plating. A complete copper film could be obtained in less than when the surface density of silver particles was greater than and an appropriate plating solution to produce a mean copper growth rate of . After of growth and a resulting film thickness of , the measured electric resistivity of the lines was about , being very close to bulk copper. In addition, the measured peel adhesion strength between the deposited copper film and the substrate was larger than .