Inhibiting the formation of (Au1−xNix)Sn4 and reducing the consumption of Ni metallization in solder joints
2002; Springer Science+Business Media; Volume: 31; Issue: 11 Linguagem: Inglês
10.1007/s11664-002-0019-5
ISSN1543-186X
AutoresCheng–En Ho, Li-Chan Shiau, C. R. Kao,
Tópico(s)Metallurgical and Alloy Processes
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