Experimental Study and Modelling of an Adhesive-Bonded Polycarbonate Assembly for Application in Consumer Electronics
2013; Taylor & Francis; Volume: 89; Issue: 4 Linguagem: Inglês
10.1080/00218464.2013.749080
ISSN1563-518X
AutoresChee Kuang Kok, C. C. Ooi, Jin Jie Ng, Kia Wai Liew,
Tópico(s)Polymer crystallization and properties
ResumoAbstract In this work, adhesive bond strength and fracture energy were characterized using a standard Arcan fixture to provide data for product design simulation. Tests were performed on polycarbonate-adhesive-polycarbonate specimens to extract adhesive properties for numerical modelling. The bond strengths and fracture energy of the adhesive between polycarbonate substrates were determined at different loading rates and loading directions. Effects of adhesive aging were also investigated. Data from pure tensile (Mode I) and pure shear (Mode II) loadings were transformed into a cohesive law in a finite element model. Failure criteria were defined using damage theory. Simulations at different loading angles were compared with experimental results to evaluate the appropriateness of such a model. Simulation results were in good agreement with experiment in most cases. This study highlights the feasibility and challenges related to adhesive characterization using a standard Arcan test for modelling with a cohesive law. KEYWORDS: Bond strengthCohesive lawFinite element methodPolycarbonate-based adhesiveStandard Arcan test ACKNOWLEDGMENT This work is an industry-university collaboration project with Motorola Solutions Malaysia Sdn. Bhd. The technical contribution of our research partner is highly appreciated.
Referência(s)