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Thermophysical properties of low-residual stress, Silicon-rich, LPCVD silicon nitride films

1990; Elsevier BV; Volume: 23; Issue: 1-3 Linguagem: Inglês

10.1016/0924-4247(90)87046-l

ISSN

1873-3069

Autores

Carlos H. Mastrangelo, Yu‐Chong Tai, R.S. Muller,

Tópico(s)

Thermal properties of materials

Resumo

The thermal properties of low-residual stress, low-pressure chemical-vapor-deposited (LPCVD), silicon nitride (Si1.0N1.1) have been extracted f

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