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Artigo Revisado por pares
BIBTEX RIS

Effects of annealing and current stressing on the intermetallic compounds growth kinetics of Cu/thin Sn/Cu bump

2011; Elsevier BV; Volume: 89; Linguagem: Inglês

10.1016/j.mee.2011.04.025

ISSN

1873-5568

Autores

Myeong-Hyeok Jeong, Jaewon Kim, Byung-Hyun Kwak, Young-Bae Park,

Tópico(s)

Copper Interconnects and Reliability

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