Refractive index, relaxation times and the viscoelastic model in dry-grown SiO2 films on Si
1987; American Institute of Physics; Volume: 51; Issue: 18 Linguagem: Inglês
10.1063/1.98642
ISSN1520-8842
AutoresL. M. Landsberger, William A. Tiller,
Tópico(s)Thin-Film Transistor Technologies
ResumoInert thermal anneals were performed at various temperatures to determine annealing kinetics of dry thermally grown SiO2 films on Si. Two stages of relaxation are demonstrated. The film relaxes quickly to an intermediate level, and then progresses more slowly toward full relaxation. The relaxation times to attain the fully relaxed refractive index, 1.460, and full ≤3% swelling were found to fall below typical oxidation times at T≥1150 °C, in concurrence with the experimentally observed breakpoint in the refractive index versus growth temperature data. It is concluded that the linear viscoelastic model is sufficient to quantitatively explain the breakpoints in refractive index for both wet and dry thermally grown oxide.
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