Micromachining of (hhl) silicon structures: experiments and 3D simulation of etched shapes
1997; Elsevier BV; Volume: 60; Issue: 1-3 Linguagem: Inglês
10.1016/s0924-4247(96)01418-5
ISSN1873-3069
Autores Tópico(s)Nanowire Synthesis and Applications
ResumoThe micromachining of various (hhl) silicon plates in a 35% KOH-water etchant is studied. Experimental shapes for membranes and mesa etched with initially circular masks are discussed. Theoretical 3D etched shapes for such microstructures are derived from a numerical simulation based on the tensorial model for the anisotropic wet etching. Experimental and theoretical shapes show a fair agreement, indicating a satisfactory adjustment of the dissolution slowness surface related to the etching of silicon in KOH etchant. The interest of the 3D simulation for designing mask patterns is outlined.
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