Portal de Periódicos da CAPES

Cost/Performance Single-Chip Module

1982; IBM; Volume: 26; Issue: 3 Linguagem: Inglês

10.1147/rd.263.0278

2151-8556

Diana Bendz, Ronald W. Gedney, J. Rasile,

Semiconductor materials and devices

The introduction of the high performance T 2 L device technology for the IBM 4300 Systems and the System/38 required extensions of the 24-mm metallized ceramic module used in prior IBM systems. The extension of the metallized ceramic technology into a physically larger 28-mm module, electrically enhanced with a reference plane and with fine line (0.025-mm) wiring, is described. The reliability of this module was evaluated with particular emphasis on corrosion and metal migration in humid environments and on exposure to atmospheric contaminants.