Development of polyamide‐imide/silica nanocomposite enameled wire
2013; Wiley; Volume: 96; Issue: 6 Linguagem: Inglês
10.1002/ecj.11456
ISSN1942-9541
AutoresHideyuki Kikuchi, Hidehito Hanawa, Yuki Honda,
Tópico(s)Thermal Analysis in Power Transmission
ResumoAbstract Nanocomposite materials based on polyamide‐imide have not been able to prevent nano‐particles from aggregating, and therefore the development of this material has been extremely difficult. However, we prevented aggregation of nano‐particles by developing the low‐hygroscopicity solvent and the copolyamide‐imide, and commercialized a new partial discharge‐resistant enameled wire with nanocomposite polyamide‐imide insulating material in 2010. The lifetime of the newly developed partial discharge‐resistant nanocomposite polyamide‐imide enameled wire is 1000 or more times that of ordinary organic‐enameled wire. The lifetime of the new wire is also excellent in a high‐temperature atmosphere. © 2013 Wiley Periodicals, Inc. Electron Comm Jpn, 96(6): 41–48, 2013; Published online in Wiley Online Library (wileyonlinelibrary.com). DOI 10.1002/ecj.11456
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