Low temperature nanoimprint lithography using silicon nitride molds
2001; Elsevier BV; Volume: 57-58; Linguagem: Inglês
10.1016/s0167-9317(01)00435-x
ISSN1873-5568
AutoresMaan M. Alkaisi, Richard J. Blaikie, Sharee J. McNab,
Tópico(s)Force Microscopy Techniques and Applications
ResumoNanoimprint lithography has been performed at low temperatures using low stress chemical vapour deposited silicon nitride (SixNy) as a mold material, with no sticking problems and hence no need for a release agent or surfactant. Imprint temperature, and the effect of quenching have been investigated and it is found that temperatures as low as 50°C can be used successfully for imprint. Imprint profile due to resist overflow at these temperatures is discussed. Low temperature imprint is important for patterning substrates or polymer-based materials that are intolerant to high temperatures. A low temperature process could also be an advantage for alignment when the mold and substrate have different thermal expansion coefficients.
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