Interfacial reactions and mechanical properties between Sn–4.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu–0.05Ni–0.01Ge lead-free solders with the Au/Ni/Cu substrate
2011; Elsevier BV; Volume: 509; Issue: 13 Linguagem: Inglês
10.1016/j.jallcom.2011.01.114
ISSN1873-4669
AutoresYee‐Wen Yen, Yu‐Cheng Chiang, Chien-Chung Jao, D.W. Liaw, Shao-cheng Lo, Chiapyng Lee,
Tópico(s)3D IC and TSV technologies
ResumoSn–4.0Ag–0.5Cu (SAC) and Sn–4.0Ag–0.5Cu–0.05Ni–0.01Ge (SACNG) lead-free solders reacting with the Au/Ni/Cu multi-layer substrate were investigated in this study. All reaction couples were reflowed at 240 and 255 °C for a few minutes and then aged at 150 °C for 100–500 h. The (Cu, Ni, Au)6Sn5 phase was formed by reflowing for 3 min at the interface. If the reflowing time was increased to 10 min, both (Cu, Ni, Au)6Sn5 and (Ni, Cu, Au)3Sn4 phases formed at the interface. The AuSn4 phase was found in the solder for all reaction couples. An addition of Ni and Ge to the solder does not significantly affect the IMC formation. After a long period of heat-treatment, the thickness of the (Cu, Ni, Au)6Sn5 and (Ni, Cu, Au)3Sn4 phases increased and the intermetallic compounds (IMCs) growth mechanism obeyed the parabolic law and the IMC growth mechanism was diffusion-controlled. The mechanical strengths for both the soldered joints decreased with increasing thermal aging time. The SACNG/Au/Ni/Cu couple had better mechanical strength than that in the SAC/Au/Ni/Cu couple.
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