Effects of chemical and thermal treatments on the composition of 2024 aluminum adherend surfaces
1978; Elsevier BV; Volume: 1; Issue: 2 Linguagem: Inglês
10.1016/0378-5963(78)90015-6
ISSN1878-1071
AutoresTairen Sun, J.M. Chen, J. D. Venables, R.L. Hopping,
Tópico(s)Electron and X-Ray Spectroscopy Techniques
ResumoAuger electron spectroscopy (AES) has been used to characterize the chemical composition of 2024-T3 Al alloy surfaces prepared by the Forest Products Laboratory (FPL) process. It is found that the chemical composition of an adherend surface depends not only on the method of surface preparation but also on the procedure by which an adhesive/Al bond is formed. A standard FPL etching with a 350°F bond curing operation causes excessive accumulations of Cu and Mg at the surface. The Cu accumulation is formed at the oxide/metal interface and the Mg accumulation within the oxide film. Both Cu and Mg accumulations in the Al surface are believed to be detrimental to environmental durability of bonds.
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