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Affected Volume and Temperature Rise During Discontinuous Slip at Low Temperatures

1968; American Institute of Physics; Volume: 39; Issue: 6 Linguagem: Inglês

10.1063/1.1656675

1520-8850

Joachim C. Erdmann, James A. Jahoda,

Electronic Packaging and Soldering Technologies

The temperature transients arising from discontinuous slip in copper-nickel alloys at helium temperature have been observed with thermometers of defined inertia properties. It is found that this type of slip can propagate through the specimen similar to a Luders band. In the discussed case, the temperature rises from approximately 5°K to approximately 35°K, and the mean value of the volume affected by each slip is 1.4×10−3 cm3. This volume corresponds very closely to the range of thermal diffusion during the time interval of slip. Thus, it is consistent with the assumption that discontinuous slip at low temperatures results from thermal feedback.